Discover the ultimate solution for your soldering needs with our Tin Solder Paste Sn96.5 Ag3 Cu0.5, designed for high-temperature applications and strong adhesion. This versatile solder paste is perfect for maintaining and repairing circuit boards in TVs, mobile phones, and other electronic devices. 217 ℃ High Melting Point: Our solder paste is crafted with an environmentally friendly alloy composition of Sn96.5/Ag3/Cu0.5, boasting a high melting point of 217 degrees Celsius. This ensures reliable performance in high-temperature environments, making it ideal for demanding soldering tasks. Scope of Application: Engineered for precision, this solder paste excels in continuous printing performance. It is perfectly suited for fine pitch ICC, BGA, and other precise component soldering. Whether you're working on circuit boards, ICs, telephones, TVs, or other household appliances and industrial equipment, this paste delivers exceptional results. Strong Adhesion: Experience superior adhesion with our soldering flux paste, which creates bright, clean solder joints with minimal residue. Its excellent conductivity and fine paste consistency ensure a professional finish every time. Strong Dry Resistance: Our tin paste offers excellent wettability and demoldability, with strong resistance to both cold and hot collapse. It maintains its integrity under various conditions, providing reliable performance and durability. Lightweight and Portable: Packaged in a convenient 45g container, this solder paste is compact and easy to carry. Whether you're working in the lab or on-site, its portability ensures you can easily transport and use it wherever needed. Upgrade your soldering toolkit with our high-performance Tin Solder Paste Sn96.5 Ag3 Cu0.5, and achieve professional-quality results with ease and efficiency.