Power Thermal Noise and Signal Integrity Issues on Substrate/Interconnects Entanglement

R3 299,00
+ R386,49 Shipping
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Power Thermal Noise and Signal Integrity Issues on Substrate/Interconnects Entanglement

Power Thermal Noise and Signal Integrity Issues on Substrate/Interconnects Entanglement

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Power Thermal Noise and Signal Integrity Issues on Substrate/Interconnects Entanglement

R3 299,00

Only 1 left in stock
+ R386,49 Shipping

14-Day Returns Policy

Sold by:

R3 299,00

Only 1 left in stock
+ R386,49 Shipping

14-Day Returns Policy

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Description

Power Thermal Noise and Signal Integrity Issues on Substrate/Interconnects Entanglement

New insights have to be developed in many domains including electrical thermal noise interconnects and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm going to a synthesis beginning between many technical aspects.
  • Brand: Taylor & Francis Ltd
  • Category: Computing & Internet
  • Format: Hardback
  • Language: English
  • Publication Date: 2025-09-04
  • Publisher / Label: Taylor & Francis Ltd
  • Author: Yue Ma
  • Number of Pages: 226
  • Fruugo ID: 434312144-911519312
  • ISBN: 9780367023430

Delivery & Returns

Dispatched within 6 days

  • STANDARD: R386,49 - Delivery between Mon 16 March 2026–Fri 03 April 2026

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